Why is hydrogen chloride (HCl) indispensable in modern semiconductor fabs?
HCl gas plays a pivotal role in chip manufacturing due to its unique chemical properties:
Precision Etching: Enables nanoscale removal of silicon nitride (Si₃N₄) and silicon dioxide (SiO₂) layers during plasma etching, critical for 5nm/3nm node FinFET and GAA transistors.
CVD/ALD Chamber Cleaning: Eliminates residual silicon, tungsten, and metal-organic deposits in reactors, ensuring contamination-free thin film deposition.
Epitaxial Growth: Enhances silicon crystal purity in 300mm wafer epitaxy, directly impacting chip performance and yield.
Photolithography Support: Neutralizes alkaline developers in EUV lithography processes.
What makes your HCl gas suitable for cutting-edge semiconductor processes?
Our HCl gas exceeds industry benchmarks with:
99.999% (5N) Purity: Impurity levels controlled at <0.1 ppm for moisture (H₂O), oxygen (O₂), and particulates.
SEMI C3.61 Certification: Compliant with global semiconductor material standards for trace metals (Na, K, Fe <5 ppb).
Strict Process Control: Produced via triple-distillation in quartz-lined reactors to prevent metallic contamination.
How do your packaging solutions address fab requirements?
We provide two optimized configurations:
47L Cylinder (25kg HCl Gas) : Ideal for R&D labs, pilot lines, and low-volume production.
Advantages:
316L electropolished stainless steel interior.
CGA 330 valve with PTFE seals.
Pre-purged with nitrogen to <10 ppb moisture.
880L Cylinder Bundle (500kg HCl Gas) : Designed for high-volume fabs with 24/7 operations.
Advantages:
Reduces changeover frequency by 80% vs. standard cylinders.
Integrated pressure regulators (0-600 psi adjustable output).
DOT/TPED-certified for bulk hazardous gas transport.
What safety measures ensure reliable HCl gas delivery?
Leak Testing: Helium mass spectrometer checks at 1×10⁻¹⁰ atm·cc/sec sensitivity.
Material Compatibility: Valves and cylinders resist HCl corrosion (Hastelloy optional).
Emergency Response: 24hours with multilingual technical support.
Compliance Documentation: Full MSDS, COA, and TDS aligned with REACH, RoHS, and ITAR.
Case Study: Enabling 3nm Chip Production
A leading foundry achieved 99.98% etch uniformity by switching to our HCl gas, reducing particle defects by 40% in high-aspect-ratio contact (HARC) etching. Read the full report on our website.
Why Partner With Us?
✅ Defect-Free Guarantee: 100% batch traceability with impurity analytics.
✅ Scalable Supply: From 25kg trial orders to 10-ton annual contracts.
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